SWOP– Packaging World (Shanghai) Exposition 2025: Linking Globally, Leading the Future with Development
As a participant of the interpack alliance, a globally recognized network for processing and packaging equipment exhibitions, SWOP brings together leading industry resources. The exposition concentrates on development across the whole chain– from devices, products, and products to develop and marketing– developing a perfect system for trade and display in the international packaging market.
SWOP highlights innovative fads such as artificial intelligence, smart/automated/digital product packaging, and sustainable/lightweight/customized product packaging services. It showcases the most recent developments throughout the whole market chain, consisting of handling and product packaging equipment, packaging product manufacturing, cutting-edge materials and products, parts, printing and labeling, and packaging design.
From November 25– 27, 2025, SWOP will return to the Shanghai New International Exposition Centre with an expanded range of over 70,000 sqm. The event will certainly include advancements from around 950 leading firms and is expected to attract more than 40,000 professional site visitors from around the world. Together, they will drive the packaging market toward an extra efficient, sustainable, and intelligent future.
Shanghai NPack, a veteran exhibitor at SWOP, will certainly display its most current devices at Booth N4K17 in a 36 sqm space. Secret shows will certainly consist of:
Smart Servo Filling Machines
Smart Tracking Capping Machines
Single-Head Pick-and-Place Capping Machines
Labeling Machines
